SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a technique capable of lowering the manufacturing cost of an LCD driver while reducing the chip size. SOLUTION: On a passivation film 9 in a region where a bump 6 made of a first metal film is not formed, a passive element such as a capacitive element 7C made of a se...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAYA MASATOSHI, YONEMOCHI YASUAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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