SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide a technique capable of lowering the manufacturing cost of an LCD driver while reducing the chip size. SOLUTION: On a passivation film 9 in a region where a bump 6 made of a first metal film is not formed, a passive element such as a capacitive element 7C made of a se...
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a technique capable of lowering the manufacturing cost of an LCD driver while reducing the chip size. SOLUTION: On a passivation film 9 in a region where a bump 6 made of a first metal film is not formed, a passive element such as a capacitive element 7C made of a second metal film, a resistive element 7R, or an inductance element 7L, etc., is formed. The first metal film is a gold film, and the second metal film is a gold film, nickel film, or copper film. Alternatively, the first metal film is a multilayer film comprising a nickel film or copper film as a lower layer and a gold film as an upper layer, and the second metal film is a nickel film or copper film. Further, the first metal film is as thick as the second metal film or thicker than the second metal film. COPYRIGHT: (C)2009,JPO&INPIT |
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