THERMAL PRINT HEAD
PROBLEM TO BE SOLVED: To prevent the deformation of a heat generating element substrate, caused by a protective layer. SOLUTION: A thermal print head includes: a heat radiation substrate 10 on which the heat generating element substrate 20 with a plurality of heat generating elements 22 arrayed ther...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To prevent the deformation of a heat generating element substrate, caused by a protective layer. SOLUTION: A thermal print head includes: a heat radiation substrate 10 on which the heat generating element substrate 20 with a plurality of heat generating elements 22 arrayed thereon, and a circuit substrate 30 with an abutting portion 25 formed while abutting to the side edge of the heat generating element substrate 20 are disposed; an IC driver 31 disposed near the abutting portion 25 of the substrates 20 and 30; and the thermosetting resin protective layer 42 that covers bonding wires 40 and 41. A part of the heat generating element substrate 20 and the circuit substrate 30 are bonded to the heat radiation substrate surface with a double-sided adhesive tape 32 extending across the substrates 20 and 30, then, the heat radiation substrate 10 is prevented from being exposed to the protective layer 42 through the abutting portion 25. COPYRIGHT: (C)2009,JPO&INPIT |
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