METHOD FOR MANUFACTURING MULTILAYER BOARD

PROBLEM TO BE SOLVED: To prevent curving while suppressing defects such as a void and a blur by uniformly applying suitable pressure to a place where a gap region is formed wherein no conductor wiring is formed when an internal layer material having the gap region formed between a plurality of wiring regions is used to manufacture a multilayer board through heat and pressure molding. SOLUTION: A projection member 2 having projection regions 11 where a plurality of projection portions 10 are formed on at least one surface of a base 7 is stacked together with a laminate 5 composed of the internal layer material 1, a resin sheet material 3, and metal foil 4 such that the projection regions 11 overlap gap regions 9 of the internal layer material 1. In this state, heat and pressure molding is carried out. In this case, the suitable pressure can be applied to the gap regions 9 through the projection regions 11 provided to the projection member 2 during the heat and pressure molding and then resin flow can be accelerated. Further, even if any of the projection portions 10 overlaps a wiring region 8, the other projection portions 10 overlap with the gap regions 9, so ununiformity of pressure in the gap regions 9 is suppressed. COPYRIGHT: (C)2009,JPO&INPIT