SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a semiconductor device in which the mounting density of components on a substrate can be enhanced. SOLUTION: The semiconductor device comprises a substrate 5, in which a mounting terminal 6A is provided on one surface 5a in the thickness direction, while a connection...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SAITO AKIRA, TAKEOKA YOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!