SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a semiconductor device in which the mounting density of components on a substrate can be enhanced. SOLUTION: The semiconductor device comprises a substrate 5, in which a mounting terminal 6A is provided on one surface 5a in the thickness direction, while a connection terminal 11 for external connection is provided on the other surface 5b; a semiconductor chip 7 which is mounted on one surface 5a of the substrate 5 by connecting a pad 12, which faces the mounting terminal 6A to the mounting terminal 6A, and a reinforcing plate 8A fixed to the surface of the semiconductor chip 7, which is on the opposite side of the substrate 5. The reinforcing plate 8A is accommodated on the semiconductor chip 7. COPYRIGHT: (C)2009,JPO&INPIT