COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD

PROBLEM TO BE SOLVED: To provide a component mounting device and a component mounting method, capable of loading components without generating a failure like a Manhattan phenomenon and without lowering tact as before even when loading the components on the other surface of a substrate contracted by heating during reflow after loading the components on one surface. SOLUTION: The position of solder S printed on the other surface of the substrate 1 is acquired on the basis of the position data of the opening 2A of a mask 2 for solder printing set beforehand, the position of a land 1B on the other surface of the substrate 1 is acquired on the basis of an imaged result by an imaging means 102A, and the maximum deviation amount between the acquired position of the solder S and the position of the land 1B is calculated. Whether the calculated maximum deviation amount is equal to or less than an allowable deviation amount is determined, and when it is equal to or less than the allowable deviation amount, the component is loaded on the position of the printed solder S. COPYRIGHT: (C)2009,JPO&INPIT