METHOD OF MANUFACTURING COPPER WIRING INSULATION FILM, AND COPPER WIRING INSULATION FILM MANUFACTURED FROM THE SAME

PROBLEM TO BE SOLVED: To provide an unprecedented method of manufacturing a copper wiring insulation film capable of forming a fine wiring which has excellent bondability between a copper foil and an insulation film and is excellent in linearity by using a semi-additive method while using an ultra-f...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YOKOZAWA YOSHIHIRO, NARUI KOJI, SHIMOKAWA HIROTO, BANBA KEITA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	YOKOZAWA YOSHIHIRO NARUI KOJI SHIMOKAWA HIROTO BANBA KEITA
description	PROBLEM TO BE SOLVED: To provide an unprecedented method of manufacturing a copper wiring insulation film capable of forming a fine wiring which has excellent bondability between a copper foil and an insulation film and is excellent in linearity by using a semi-additive method while using an ultra-fine copper foil laminate insulation film, and is excellent in circuit visibility. SOLUTION: The method for manufacturing a copper wiring insulation film by a semi-additive method uses a copper foil laminate insulation film in which a copper foil is laminated on a single surface or both surfaces of an insulation film, wherein the copper foil laminate insulation film is obtained by laminating a copper foil having following features (a) and (b) to the insulation film. COPYRIGHT: (C)2009,JPO&INPIT
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2009176770A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2009176770A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2009176770A3</originalsourceid><addsrcrecordid>eNrjZCj2dQ3x8HdR8HdT8HX0C3VzdA4JDfL0c1dw9g8IcA1SCPcE8zz9gkN9HEM8_f0U3Dx9fHUUHP1c8CtBMs7VRcEtyN9XIcTDVSHY0deVh4E1LTGnOJUXSnMzKLm5hjh76KYW5MenFhckJqfmpZbEewUYGRhYGpqbmZsbOBoTpQgA_YE5LQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF MANUFACTURING COPPER WIRING INSULATION FILM, AND COPPER WIRING INSULATION FILM MANUFACTURED FROM THE SAME</title><source>esp@cenet</source><creator>YOKOZAWA YOSHIHIRO ; NARUI KOJI ; SHIMOKAWA HIROTO ; BANBA KEITA</creator><creatorcontrib>YOKOZAWA YOSHIHIRO ; NARUI KOJI ; SHIMOKAWA HIROTO ; BANBA KEITA</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide an unprecedented method of manufacturing a copper wiring insulation film capable of forming a fine wiring which has excellent bondability between a copper foil and an insulation film and is excellent in linearity by using a semi-additive method while using an ultra-fine copper foil laminate insulation film, and is excellent in circuit visibility. SOLUTION: The method for manufacturing a copper wiring insulation film by a semi-additive method uses a copper foil laminate insulation film in which a copper foil is laminated on a single surface or both surfaces of an insulation film, wherein the copper foil laminate insulation film is obtained by laminating a copper foil having following features (a) and (b) to the insulation film. COPYRIGHT: (C)2009,JPO&INPIT</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONDUCTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSULATORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090806&DB=EPODOC&CC=JP&NR=2009176770A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090806&DB=EPODOC&CC=JP&NR=2009176770A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOKOZAWA YOSHIHIRO</creatorcontrib><creatorcontrib>NARUI KOJI</creatorcontrib><creatorcontrib>SHIMOKAWA HIROTO</creatorcontrib><creatorcontrib>BANBA KEITA</creatorcontrib><title>METHOD OF MANUFACTURING COPPER WIRING INSULATION FILM, AND COPPER WIRING INSULATION FILM MANUFACTURED FROM THE SAME</title><description>PROBLEM TO BE SOLVED: To provide an unprecedented method of manufacturing a copper wiring insulation film capable of forming a fine wiring which has excellent bondability between a copper foil and an insulation film and is excellent in linearity by using a semi-additive method while using an ultra-fine copper foil laminate insulation film, and is excellent in circuit visibility. SOLUTION: The method for manufacturing a copper wiring insulation film by a semi-additive method uses a copper foil laminate insulation film in which a copper foil is laminated on a single surface or both surfaces of an insulation film, wherein the copper foil laminate insulation film is obtained by laminating a copper foil having following features (a) and (b) to the insulation film. COPYRIGHT: (C)2009,JPO&INPIT</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONDUCTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZCj2dQ3x8HdR8HdT8HX0C3VzdA4JDfL0c1dw9g8IcA1SCPcE8zz9gkN9HEM8_f0U3Dx9fHUUHP1c8CtBMs7VRcEtyN9XIcTDVSHY0deVh4E1LTGnOJUXSnMzKLm5hjh76KYW5MenFhckJqfmpZbEewUYGRhYGpqbmZsbOBoTpQgA_YE5LQ</recordid><startdate>20090806</startdate><enddate>20090806</enddate><creator>YOKOZAWA YOSHIHIRO</creator><creator>NARUI KOJI</creator><creator>SHIMOKAWA HIROTO</creator><creator>BANBA KEITA</creator><scope>EVB</scope></search><sort><creationdate>20090806</creationdate><title>METHOD OF MANUFACTURING COPPER WIRING INSULATION FILM, AND COPPER WIRING INSULATION FILM MANUFACTURED FROM THE SAME</title><author>YOKOZAWA YOSHIHIRO ; NARUI KOJI ; SHIMOKAWA HIROTO ; BANBA KEITA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2009176770A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONDUCTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>YOKOZAWA YOSHIHIRO</creatorcontrib><creatorcontrib>NARUI KOJI</creatorcontrib><creatorcontrib>SHIMOKAWA HIROTO</creatorcontrib><creatorcontrib>BANBA KEITA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOKOZAWA YOSHIHIRO</au><au>NARUI KOJI</au><au>SHIMOKAWA HIROTO</au><au>BANBA KEITA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF MANUFACTURING COPPER WIRING INSULATION FILM, AND COPPER WIRING INSULATION FILM MANUFACTURED FROM THE SAME</title><date>2009-08-06</date><risdate>2009</risdate><abstract>PROBLEM TO BE SOLVED: To provide an unprecedented method of manufacturing a copper wiring insulation film capable of forming a fine wiring which has excellent bondability between a copper foil and an insulation film and is excellent in linearity by using a semi-additive method while using an ultra-fine copper foil laminate insulation film, and is excellent in circuit visibility. SOLUTION: The method for manufacturing a copper wiring insulation film by a semi-additive method uses a copper foil laminate insulation film in which a copper foil is laminated on a single surface or both surfaces of an insulation film, wherein the copper foil laminate insulation film is obtained by laminating a copper foil having following features (a) and (b) to the insulation film. COPYRIGHT: (C)2009,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_JP2009176770A
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
title	METHOD OF MANUFACTURING COPPER WIRING INSULATION FILM, AND COPPER WIRING INSULATION FILM MANUFACTURED FROM THE SAME
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T00%3A53%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YOKOZAWA%20YOSHIHIRO&rft.date=2009-08-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2009176770A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true