METHOD OF MANUFACTURING COPPER WIRING INSULATION FILM, AND COPPER WIRING INSULATION FILM MANUFACTURED FROM THE SAME

PROBLEM TO BE SOLVED: To provide an unprecedented method of manufacturing a copper wiring insulation film capable of forming a fine wiring which has excellent bondability between a copper foil and an insulation film and is excellent in linearity by using a semi-additive method while using an ultra-f...

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Bibliographische Detailangaben
Hauptverfasser:	YOKOZAWA YOSHIHIRO, NARUI KOJI, SHIMOKAWA HIROTO, BANBA KEITA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an unprecedented method of manufacturing a copper wiring insulation film capable of forming a fine wiring which has excellent bondability between a copper foil and an insulation film and is excellent in linearity by using a semi-additive method while using an ultra-fine copper foil laminate insulation film, and is excellent in circuit visibility. SOLUTION: The method for manufacturing a copper wiring insulation film by a semi-additive method uses a copper foil laminate insulation film in which a copper foil is laminated on a single surface or both surfaces of an insulation film, wherein the copper foil laminate insulation film is obtained by laminating a copper foil having following features (a) and (b) to the insulation film. COPYRIGHT: (C)2009,JPO&INPIT