METHOD FOR MANUFACTURING COPPER WIRING INSULATION FILM USING SEMI-ADDITIVE METHOD, AND COPPER WIRING INSULATION FILM MANUFACTURED FROM THE SAME

PROBLEM TO BE SOLVED: To provide a method for manufacturing a copper wiring insulation film using a semi-additive method, which suppresses the occurrence of connection failure or wiring fall when mounting chips such as IC chips using a carrier-equipped copper foil laminate insulation film, and is ap...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOKOZAWA YOSHIHIRO, NARUI KOJI, SHIMOKAWA HIROTO, BANBA KEITA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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