THERMOSETTING RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition capable of giving a molded article having high thermal conductivity and high electric insulation and showing excellent mechanical strength. SOLUTION: The thermosetting resin composition includes a thermally conductive filler wherein...

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Bibliographische Detailangaben
Hauptverfasser:	UEDA HIDEAKI, TABUCHI MASAHITO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a thermosetting resin composition capable of giving a molded article having high thermal conductivity and high electric insulation and showing excellent mechanical strength. SOLUTION: The thermosetting resin composition includes a thermally conductive filler wherein the thermosetting resin contains a diallyl phthalate monomer and/or a diallyl phthalate oligomer, the content of the thermally conductive filler is 200 to 1,400 pts.wt. based on 100 pts.wt. of the whole thermosetting resin, and the cured material of the composition has thermal conductivity of not less than 1 W/m×K and insulation resistance of not less than 1×1013Ω. COPYRIGHT: (C)2009,JPO&INPIT