MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of preventing generation of dust due to friction between a substrate and a substrate support. SOLUTION: By introducing a step of inserting a substrate support 30 with a substrate 54 mounted thereon in a reactor...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: TERASAKI MASATO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of preventing generation of dust due to friction between a substrate and a substrate support. SOLUTION: By introducing a step of inserting a substrate support 30 with a substrate 54 mounted thereon in a reactor 40, and thereafter stabilizing the temperature of the substrate and that of the substrate support 30 before evacuating the inside of the reactor 40, the generation of dust due to friction between the substrate 54 and the substrate support 30 in evacuating the inside of the reactor 40 is prevented. COPYRIGHT: (C)2009,JPO&INPIT