JOINING MATERIAL AND JUNCTION FORMING METHOD
PROBLEM TO BE SOLVED: To provide metal particles coated with organic matter, wherein low temperature joinability is improved while keeping dispersibility equal to that of conventional metal particles coated with organic matter. SOLUTION: This invention relates to a method for forming junction betwee...
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| creator | HIDA MOTOI YASUDA TAKESUKE |
| description | PROBLEM TO BE SOLVED: To provide metal particles coated with organic matter, wherein low temperature joinability is improved while keeping dispersibility equal to that of conventional metal particles coated with organic matter. SOLUTION: This invention relates to a method for forming junction between materials using a joining material containing metal particles coated with an organic material, wherein the organic matter is secondary amine of ≤250 molecular weight; the metal particles are composed of a simple substance of silver, copper or gold or an alloy thereof, having ≤100 nm average particle size; and, after the joining material is applied to the materials to be joined, heating is applied at 50 to 400°C for 1 sec to 10 min to form a metal sintered body between the materials to be joined. COPYRIGHT: (C)2009,JPO&INPIT |
| format | Patent |
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SOLUTION: This invention relates to a method for forming junction between materials using a joining material containing metal particles coated with an organic material, wherein the organic matter is secondary amine of ≤250 molecular weight; the metal particles are composed of a simple substance of silver, copper or gold or an alloy thereof, having ≤100 nm average particle size; and, after the joining material is applied to the materials to be joined, heating is applied at 50 to 400°C for 1 sec to 10 min to form a metal sintered body between the materials to be joined. 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| language | eng |
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| subjects | CASTING MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER PERFORMING OPERATIONS POWDER METALLURGY TRANSPORTING WORKING METALLIC POWDER |
| title | JOINING MATERIAL AND JUNCTION FORMING METHOD |
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