JOINING MATERIAL AND JUNCTION FORMING METHOD

PROBLEM TO BE SOLVED: To provide metal particles coated with organic matter, wherein low temperature joinability is improved while keeping dispersibility equal to that of conventional metal particles coated with organic matter. SOLUTION: This invention relates to a method for forming junction between materials using a joining material containing metal particles coated with an organic material, wherein the organic matter is secondary amine of ≤250 molecular weight; the metal particles are composed of a simple substance of silver, copper or gold or an alloy thereof, having ≤100 nm average particle size; and, after the joining material is applied to the materials to be joined, heating is applied at 50 to 400°C for 1 sec to 10 min to form a metal sintered body between the materials to be joined. COPYRIGHT: (C)2009,JPO&INPIT