LOW THERMAL EXPANSION LOW DIELECTRIC LOSS PREPREG AND ITS APPLIED ARTICLE

PROBLEM TO BE SOLVED: To provide a high frequency ready wiring board material reduced in a dielectric dissipation factor, weight, a coefficient of thermal expansion in the Z direction, and cost without deteriorating workability, and to provide an electronic component using the wiring board material. SOLUTION: The prepreg is produced by compounding polyolefin fibers, glass fibers and a low thermal expansion resin composition. In an electrical component, a cured product of the prepreg serves as an insulating layer. By compounding the both fibers, reduction in weight, improvement in workability, and reduction in cost can be achieved in a base material, and the prepreg can be suitably used for wiring materials of various electronic apparatuses using high frequency signals. COPYRIGHT: (C)2009,JPO&INPIT