METHOD FOR MANUFACTURING RADIATION SUBSTRATE AND RADIATION SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a radiation substrate, capable of forming a device while improving radiation property, and improving controllability of thickness of the substrate, and a radiation substrate manufactured thereby. SOLUTION: The method for manufacturing the r...

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1. Verfasser: CHIKUNO TAKASHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for manufacturing a radiation substrate, capable of forming a device while improving radiation property, and improving controllability of thickness of the substrate, and a radiation substrate manufactured thereby. SOLUTION: The method for manufacturing the radiation substrate comprises the following steps. A substrate 11 including a first main face 11a having a recessed part 11a1 having a depth of 0.4 μm to 300 μm and an area of 5 μm2or more formed thereon and a second main face 11b opposite to the first main face 11a, and formed of a material free from diamond is prepared. A diamond layer 13 with a thickness of the depth of the recessed part 11a1 or more is developed on the first main face 11a by gas phase method. The second main face 11b is then polished using a protruding part 13a1 of the diamond layer 13 located within the recessed part 11a1 as a stopper of polishing. COPYRIGHT: (C)2009,JPO&INPIT