SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND LEAD FRAME AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a semiconductor device which uses a plating material that can reduce cost, on a terminal face of at least a substrate-side mounting surface to permit application of thick plating and can form an oxidation preventive film on the side surface of a mounting-side termina...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUNAGA KIYOSHI, MORI SHUJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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