SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND LEAD FRAME AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a semiconductor device which uses a plating material that can reduce cost, on a terminal face of at least a substrate-side mounting surface to permit application of thick plating and can form an oxidation preventive film on the side surface of a mounting-side terminal, and to provide a manufacturing method thereof, as well as a lead frame and a manufacturing method thereof. SOLUTION: The semiconductor device is provided with a semiconductor element 11, columnar terminals 14 arranged like an area array in its periphery, and a bonding wire 16 which electrically connects an electrode pad 15 of the semiconductor pad 11 with a wire bonding part 12 of the columnar terminals 14. The semiconductor element 11, the bonding wire 16 and a part of the columnar terminals 14 are packaged by a resin, and a part of each of the columnar terminals 14 is projected from the lower end of the sealing resin 17, and then each of the columnar terminals 14 is formed by half etching from the front side and rear side, respectively. Gold plating 23 is applied onto the upper surface of the respective columnar terminals 14, and tin plating 25 or solder plating made mainly of tin is applied onto the lower surface of the respective columnar terminals 14 projecting from the sealing resin 17. COPYRIGHT: (C)2009,JPO&INPIT