SUBSTRATE CONNECTION STRUCTURE AND ELECTRONIC APPLIANCE

PROBLEM TO BE SOLVED: To provide a substrate connection structure having a fixing part restraining peel-off from the circuit substrate or the flexible printed board by maintaining the connection state of the circuit substrate and the flexible printed board connected by an anisotropic conductive film...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAKEGAWA HIDETO, TERADA KAZUTAKA, HARIKAE MASATO, ISHIDA YUJI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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