SUBSTRATE CONNECTION STRUCTURE AND ELECTRONIC APPLIANCE

PROBLEM TO BE SOLVED: To provide a substrate connection structure having a fixing part restraining peel-off from the circuit substrate or the flexible printed board by maintaining the connection state of the circuit substrate and the flexible printed board connected by an anisotropic conductive film...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAKEGAWA HIDETO, TERADA KAZUTAKA, HARIKAE MASATO, ISHIDA YUJI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a substrate connection structure having a fixing part restraining peel-off from the circuit substrate or the flexible printed board by maintaining the connection state of the circuit substrate and the flexible printed board connected by an anisotropic conductive film, and also to provide an electronic appliance. SOLUTION: The substrate connection structure has a key substrate 50 with a rugged shape 331 formed on the end face 310, a flexible printed board 90, and an anisotropic conductive film. It also has a fixing part 200 disposed for connecting an opening part 98 formed in the flexible printed board 90, the whole or a part of the end face 310, and the whole or a part of the internal surface in the opening part 98. The fixing part 200 is for fixing the key substrate 50 and the flexible printed board 90 by solidifying an adhesive having a flowability. COPYRIGHT: (C)2009,JPO&INPIT