SUBSTRATE CONNECTION STRUCTURE AND ELECTRONIC APPLIANCE

SUBSTRATE CONNECTION STRUCTURE AND ELECTRONIC APPLIANCE

PROBLEM TO BE SOLVED: To provide a substrate connection structure having a fixing part restraining peel-off from the circuit substrate or the flexible printed board by maintaining the connection state of the circuit substrate and the flexible printed board connected by an anisotropic conductive film...

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Hauptverfasser: TAKEGAWA HIDETO, TERADA KAZUTAKA, HARIKAE MASATO, ISHIDA YUJI
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator TAKEGAWA HIDETO
TERADA KAZUTAKA
HARIKAE MASATO
ISHIDA YUJI
description PROBLEM TO BE SOLVED: To provide a substrate connection structure having a fixing part restraining peel-off from the circuit substrate or the flexible printed board by maintaining the connection state of the circuit substrate and the flexible printed board connected by an anisotropic conductive film, and also to provide an electronic appliance. SOLUTION: The substrate connection structure has a key substrate 50 with a rugged shape 331 formed on the end face 310, a flexible printed board 90, and an anisotropic conductive film. It also has a fixing part 200 disposed for connecting an opening part 98 formed in the flexible printed board 90, the whole or a part of the end face 310, and the whole or a part of the internal surface in the opening part 98. The fixing part 200 is for fixing the key substrate 50 and the flexible printed board 90 by solidifying an adhesive having a flowability. COPYRIGHT: (C)2009,JPO&INPIT
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title SUBSTRATE CONNECTION STRUCTURE AND ELECTRONIC APPLIANCE
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