ADHESIVE RESIN COMPOSITION, AND MANUFACTURING METHOD FOR CERAMIC SUBSTRATE USING THE SAME

PROBLEM TO BE SOLVED: To provide an adhesive resin composition capable of restraining a conductive paste from being deformed or diffused toward its periphery, when baking a laminate bonded with the second ceramic green sheet onto the first ceramic green sheet having the pattern-like conductive paste...

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Bibliographische Detailangaben
Hauptverfasser: TAKASE HIROYUKI, NAGATA YOSHIKATSU, MUROTANI TAKESHI, FURUKUBO YOJI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an adhesive resin composition capable of restraining a conductive paste from being deformed or diffused toward its periphery, when baking a laminate bonded with the second ceramic green sheet onto the first ceramic green sheet having the pattern-like conductive paste on its surface, via the adhesive resin composition, and a manufacturing method for a ceramic substrate using the same. SOLUTION: This adhesive resin composition 3, for bonding the second ceramic green sheet onto the first ceramic green sheet coated with the pattern-like conductive paste on its surface, contains at least two resin compositions different in thermal decomposabilities, and satisfies (T1+30)≤T2, where T1°C represents a temperature of weight-reducing 20% of the resin component pyrolyzed in the lowest temperature side, and T2°C represents a temperature of weight-reducing 20% of the resin component pyrolyzed in the highest temperature side. COPYRIGHT: (C)2009,JPO&INPIT