FLIP CHIP BONDING APPARATUS AND FLIP CHIP BONDING METHOD

PROBLEM TO BE SOLVED: To provide a flip chip bonding apparatus and a flip chip bonding method which eliminate a need of using an expensive heater capable of changing a heating temperature or forming a cooling flow path, and to provide a flip chip bonding apparatus and a flip chip bonding method whic...

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Bibliographische Detailangaben
Hauptverfasser: KAKU HYON SEKI, KIM SHUKO, KIM SOJUN, RO SHOKI, SHIN SAIHO, LEE BYOUNG-JUN, RIN JUNJU, KIM HI SAI, SEKI SHODAI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a flip chip bonding apparatus and a flip chip bonding method which eliminate a need of using an expensive heater capable of changing a heating temperature or forming a cooling flow path, and to provide a flip chip bonding apparatus and a flip chip bonding method which are capable of bonding a flip chip to a substrate more quickly. SOLUTION: The flip chip bonding apparatus applies heat and pressure to a flip chip 20 to bond the flip chip to the substrate and includes many bonding units 30 and 40 for transmitting heat at mutually different temperatures to the flip chip. COPYRIGHT: (C)2009,JPO&INPIT