RESIN MOLD AND METHOD FOR RESIN MOLDING OF SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To provide a resin mold and a method for resin molding of semiconductor package which prevent deformation of lead frames and metal thin lines and poor appearance of resin enclosure. SOLUTION: A gate 10, from which molten resin 7 is poured into a cavity 5 enclosed by an upper mo...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KANEMITSU YASUO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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