RESIN MOLD AND METHOD FOR RESIN MOLDING OF SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To provide a resin mold and a method for resin molding of semiconductor package which prevent deformation of lead frames and metal thin lines and poor appearance of resin enclosure. SOLUTION: A gate 10, from which molten resin 7 is poured into a cavity 5 enclosed by an upper mo...

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Bibliographische Detailangaben
1. Verfasser:	KANEMITSU YASUO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin mold and a method for resin molding of semiconductor package which prevent deformation of lead frames and metal thin lines and poor appearance of resin enclosure. SOLUTION: A gate 10, from which molten resin 7 is poured into a cavity 5 enclosed by an upper mold 1 and recesses 2a and 4a of a middle mold 2 and a lower mold 4, is opened on the upper mold 1 in which a semiconductor chip 12 is placed and the bottom of the recess 2a of the middle mold 2. A first pin 14 and one or more second pins 15 are provided in the lower mold 4. The first pin 14 moves in and out between the position where a lead frame 11 is supported and the inside of the recess 4a or its proximity and the second pins 15 move in a direction opposite to the first pin 14 between an outer position of the recess and an inside portion of the recess or its proximity while the first pin moves in or out. COPYRIGHT: (C)2009,JPO&INPIT