METHOD OF MANUFACTURING CERAMIC COMPONENT

PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic component in which a projection type conductor can be formed accurately on an external electrode of the ceramic component without any position shift. SOLUTION: In a film installing step, a photoresist film which is photosensitive a...

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Bibliographische Detailangaben
Hauptverfasser:	SEKI TOSHITAKE, HIRANO SATOSHI, HIGO ICHIEI, OTSUKA ATSUSHI, YAMAMOTO HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic component in which a projection type conductor can be formed accurately on an external electrode of the ceramic component without any position shift. SOLUTION: In a film installing step, a photoresist film which is photosensitive and 200 μm thick is provided on a sintered ceramic body 104. In a direct exposure step, the photoresist film is irradiated with scanned laser light by using a direct exposure machine to be exposed. In a developing step, the exposed photoresist film is developed to form plating resist having openings for exposing planar electrodes 111, 112, 121, and 122. In a conductor forming step, the planar electrodes 111, 112, 121, and 122 exposed through the openings are subjected to plating to form projection conductors 50. COPYRIGHT: (C)2009,JPO&INPIT