ELECTRONIC COMPONENT APPARATUS

PROBLEM TO BE SOLVED: To provide an electronic component apparatus which forms terminals on an upper and lower surfaces of a package by processing a lead frame, without going through a complicated process such as height control of a stud bump and positional control of a lead bar, and to provide an electronic component apparatus wherein an external connection terminal is designed to have a sufficient area, for improved and stable connection reliability between the electronic component apparatus and a component at its upper part. SOLUTION: An terminal upper part 8a, a terminal middle part 8b, and a terminal lower part 8c are integrally formed to constitute a plurality of external connection terminals 8. At least the terminal upper part 8a is exposed from one main surface 50, the terminal middle part 8b is inclined from one main surface 50, and the terminal upper part 8a and the terminal lower part 8c bend at both ends of the terminal middle part 8b, to be substantially parallel to one main surface 50. COPYRIGHT: (C)2009,JPO&INPIT