METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE WITH ELECTRIC WIRE AND APPARATUS FOR MANUFACTURING THE SEMICONDUCTOR SUBSTRATE WITH THE ELECTRIC WIRE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor substrate with an electric wire and an apparatus for manufacturing the semiconductor substrate with the electric wire which suppress a damage of the semiconductor substrate and a reduction of productivity. SOLUTION: A semiconductor substrate W is bonded to an electric wire R with an adhesive AD which cures at a first adhesive strength in a first measure and cures at a second adhesive strength stronger than the first adhesive strength in a second measure, and the second measure is performed to the adhesive AD which has passed the first measure. The apparatus 1 for manufacturing the semiconductor substrate with the electric wire includes: an adhesive coating device 10; an electric wire feeding device 20; a holding device 30 for holding a relative position between the semiconductor substrate W and the electric wire R; an irradiating device 40 for irradiating an electromagnetic wave to the adhesive AD as the first measure or a heating device for heating the adhesive; and a heating device 50 for heating the adhesive AD as the second measure. The holding device 30 needs to press the semiconductor substrate W and the electric wire R up to the first measure. COPYRIGHT: (C)2009,JPO&INPIT