SEAL COMPOSITION, AND COMPOSITE POROUS BODY

PROBLEM TO BE SOLVED: To provide a sealing composition (especially for making a conductive porous body to be a gas diffusion layer member) which has a sealability for sealing an end surface of the conductive porous body and moldability for molding integrally with the conductive porous body and moreo...

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Bibliographische Detailangaben
Hauptverfasser: WADA MASAHIRO, KANDA EIKO, HAMAKUBO SHINJI, KOBIKI KAZUHIKO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a sealing composition (especially for making a conductive porous body to be a gas diffusion layer member) which has a sealability for sealing an end surface of the conductive porous body and moldability for molding integrally with the conductive porous body and moreover has suitable mechanical properties (hardness, strength, elongation or the like) and has an excellent chemical resistance (especially an acid resistance) and a thermal resistance. SOLUTION: The sealing composition contains: an EPDM having a Mooney viscosity 40-100 (ML(1+4) 100°C), an ethylene content 50-62 wt.%, and a dien content 2-10 wt.%; carbon black; and an organic peroxide. Preferably, the composition contains 10-120 parts weight of the carbon black and 0.5-5 parts weight of the organic peroxide per 100 parts weight of the EPDM and does not contain a plasticizer, a processing aid and a lubricant nor the like. COPYRIGHT: (C)2009,JPO&INPIT