SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND CAMERA MODULE WITH SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To inhibit a sealing resin from running on the upper face of a frame in a semiconductor device having a frame and subjected to resin sealing. SOLUTION: The semiconductor device 100 includes an insulating substrate 101, a semiconductor element 106 provided on the insulating subs...

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Bibliographische Detailangaben
Hauptverfasser:	TANAKA SHOICHI, OSAKI HIROTO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To inhibit a sealing resin from running on the upper face of a frame in a semiconductor device having a frame and subjected to resin sealing. SOLUTION: The semiconductor device 100 includes an insulating substrate 101, a semiconductor element 106 provided on the insulating substrate 101, a protector 109 provided on the semiconductor element 106, and a frame 102 provided on the peripheral edge of the insulating substrate 101 and surrounding the semiconductor element 106. A sealing resin 110 is filled inside the frame 102. At least one groove 111 formed by removing at least upper corner parts of the frame 102 is provided on the semiconductor element 106 side of the frame 102. COPYRIGHT: (C)2009,JPO&INPIT