METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve use efficiency of solder foils, by minimizing a useless solder foil part, when manufacturing rectangular solder foils by the number of a plurality of semiconductor elements. SOLUTION: In a process of preparing the plurality of semiconductor elements 1 and 2 and the solder foils 51, a rectangular shape in a plane shape of back electrodes 1b and 2b by setting the length of one side as a specific dimension A, is prepared for the whole of the plurality of semiconductor elements 1 and 2, and a plane rectangular shape of setting one side as the specific dimension A is prepared for the whole of the solder foils 51 corresponding to the individual semiconductor elements 1 and 2. The plurality of semiconductor elements 1 and 2 are mounted on a first heat radiating plate 3 via the solder foil 51 in a state where the side having the specific dimension A in the back electrodes 1b and 2b of the individual semiconductor elements 1 and 2, coincides with the side having the specific dimension A in the solder foils 51. COPYRIGHT: (C)2009,JPO&INPIT