SURFACE MOUNTING METHOD AND DEVICE

PROBLEM TO BE SOLVED: To improve reliability and quality of mounting by removing foreign matter, such as a chip component having fallen by mistake and dust, when a component is picked up by a nozzle of a movable head and mounted on a substrate. SOLUTION: When the component 22 is picked up by the nozzle 44 of the movable head 42 and mounted on the substrate 32, a component mounting position of the substrate 32 is video imaged before the component mounting, and the foreign matter 23 in the component mounting position is detected from the video-imaged image and removed. Here, the center of gravity and the size of the detected foreign matter are found and the nozzle can be replaced with a nozzle suitable for removing the foreign matter. Further, a removal destination of the foreign matter can be made selectable. COPYRIGHT: (C)2009,JPO&INPIT