CERAMIC PACKAGE, ITS MANUFACTURING METHOD, AND SOLID-STATE IMAGING DEVICE

PROBLEM TO BE SOLVED: To propose a ceramic package highly accurately assuring planarity of a mounting surface of an image sensor chip with respect to installation reference of a solid-state imaging device, its manufacturing method, and the solid-state imaging device. SOLUTION: A frame sheet 13 having an opening 13a is laminated on an upper surface of a base sheet 11, cut into a square to have the opening 13a located at the center and then baked. After baking, a protrusion 21 formed by painting a pasty alumina coating material a plurality of times is provided at three positions on an upper surface 11a on which the image sensor chip of the base sheet 11 is mounted, and the base sheet is again baked. The protrusions 21 are discretely provided on the upper surface 11a of the base sheet 11 so that a lower surface 11b of the sheet 11 serves as a positioning reference in the thickness direction of a package body 10, and that heights from a flat plane 30 are equal when the package body 10 is mounted on the flat plane 30 to bring the lower surface 11b of the sheet 11 into contact. COPYRIGHT: (C)2009,JPO&INPIT