SOLID-STATE IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC INFORMATION DEVICE
PROBLEM TO BE SOLVED: To provide a solid-state image sensor which is compact and highly sensitive and can improve further condensing efficiency even if a pixel is refined. SOLUTION: The outermost surface of a light shielding film 10 is formed at almost the same height as that of a photo diode 4, so...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a solid-state image sensor which is compact and highly sensitive and can improve further condensing efficiency even if a pixel is refined. SOLUTION: The outermost surface of a light shielding film 10 is formed at almost the same height as that of a photo diode 4, so that there is no step on the surface of a substrate. Furthermore, condensing is eased, and a slanting light can be easily taken by a light reception part, thereby preventing the degradation of sensitivity of the photo diode 4. When the method of manufacturing the solid-state image sensor 20 is used, an opening a is provided on the light shielding film 10 by applying the CMP method on the photo diode 4 of the light shielding film 10, so that plasma damage to the substrate, which occurs in the conventional technology for forming an opening on the light shielding film by employing a dry etching method, can be suppressed, and the solid-state image sensor with less white scratch can be manufactured. COPYRIGHT: (C)2009,JPO&INPIT |
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