GLASS PASTE FOR DIELECTRIC MATERIAL

PROBLEM TO BE SOLVED: To provide glass paste for a dielectric material, which can form a back dielectric layer and a barrier rib by baking them at the same time, and can improve strength and adhesiveness to the barrier rib of a back dielectric dried film; and to provide a method of manufacturing a g...

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Bibliographische Detailangaben
Hauptverfasser:	SUGIURA TOMIYA, TADAKI SHOICHI, TANIDA MASAMICHI, YAMANAKA KAZUHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MINERAL OR SLAG WOOL ORGANIC MACROMOLECULAR COMPOUNDS SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide glass paste for a dielectric material, which can form a back dielectric layer and a barrier rib by baking them at the same time, and can improve strength and adhesiveness to the barrier rib of a back dielectric dried film; and to provide a method of manufacturing a glass substrate with a barrier rib using the glass paste. SOLUTION: The glass paste for a dielectric material contains glass powder A having a softening point of ≤650°C, a resin B having active hydrogen, a compound C having two or more block isocyanate groups in one molecule, and a solvent D. In the glass paste for a dielectric material, when it is assumed that the mass of the glass powder A is 100 parts, the total mass of the resin B and the compound C is 5-50 parts. COPYRIGHT: (C)2009,JPO&INPIT