PREPREG AND ITS MANUFACTURING METHOD, AND METAL-CLAD LAMINATED BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a manufacturing method of prepreg permitting easily manufacturing of a metal-clad laminated board whose metal film has strong adhesiveness, a low coefficient of thermal expansion and high rigidity. SOLUTION: The manufacturing method of prepreg 6 is disclosed. Varnish...

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Hauptverfasser: TAKAHASHI TATSUSHI, KOIZUMI TAKESHI, MOTOBE EIJI, NOGAMI KOICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a manufacturing method of prepreg permitting easily manufacturing of a metal-clad laminated board whose metal film has strong adhesiveness, a low coefficient of thermal expansion and high rigidity. SOLUTION: The manufacturing method of prepreg 6 is disclosed. Varnish containing a thermosetting resin and an inorganic filler is applied and penetrated onto one side of a base material 3 with a coater head 1. On the application side, a filler rich layer 4 with much content of the inorganic filler is formed. On the other side, a resin rich layer 5 with little content of the inorganic filler is formed. Then, the prepreg is heated and dried until being in a semi-hardened state. COPYRIGHT: (C)2009,JPO&INPIT