WIRING BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a wiring board having a wiring board body, reducing warp of the wiring board body and making a size in a thickness direction of the wiring board to be small and to provide a method for manufacturing the wiring board. SOLUTION: The wiring board 10 includes a wiring board body 21 having an insulating layer 25 being a first insulating layer, an electronic component loading pad 24 which includes a connection face 24A to which the electronic component 11 is connected and is internally arranged in the insulating layer 25, an insulating layer 31 being a second insulating layer laminated on the insulating layer 25 and vias 27 and 33 and a wiring pattern 28, which are arranged in the insulating layers 25 and 31 and are electrically connected to the electronic component loading pad 24. A warp reducing member 22 reducing warp of the wiring board body 21 is internally arranged in the insulating layer 25. COPYRIGHT: (C)2009,JPO&INPIT