METHOD OF FORMING ELECTROCONDUCTIVE THIN LINE

PROBLEM TO BE SOLVED: To provide a method for forming a high-definition conductive thin line without blurring at low cost. SOLUTION: After a resin film having a hardness of 20 to 70 by the JIS-K-6253 type A measuring method is formed on the surface of a resin substrate, the thin line of a conductive...

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Hauptverfasser: OGATA HIROSHI, TSUBOTA MASANORI, SHIOMI HIDEKAZU
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creator OGATA HIROSHI
TSUBOTA MASANORI
SHIOMI HIDEKAZU
description PROBLEM TO BE SOLVED: To provide a method for forming a high-definition conductive thin line without blurring at low cost. SOLUTION: After a resin film having a hardness of 20 to 70 by the JIS-K-6253 type A measuring method is formed on the surface of a resin substrate, the thin line of a conductive paste is formed by the use of a method of an intaglio printing or a mimeograph printing, or a thin line pattern of electroless-plating catalytic ink is formed by the use of a method of the intaglio printing or the mimeograph printing on the resin substrate film. After that, the thin line pattern for forming a metal film on the thin line pattern by the plating process is formed to form the electroconductive thin line. COPYRIGHT: (C)2009,JPO&INPIT
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2009123791A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2009123791A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2009123791A3</originalsourceid><addsrcrecordid>eNrjZND1dQ3x8HdR8HdTcPMP8vX0c1dw9XF1Dgnyd_b3cwl1DvEMc1UI8fD0U_Dx9HPlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgaWhkbG5paGjsZEKQIACb4l8Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF FORMING ELECTROCONDUCTIVE THIN LINE</title><source>esp@cenet</source><creator>OGATA HIROSHI ; TSUBOTA MASANORI ; SHIOMI HIDEKAZU</creator><creatorcontrib>OGATA HIROSHI ; TSUBOTA MASANORI ; SHIOMI HIDEKAZU</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a method for forming a high-definition conductive thin line without blurring at low cost. SOLUTION: After a resin film having a hardness of 20 to 70 by the JIS-K-6253 type A measuring method is formed on the surface of a resin substrate, the thin line of a conductive paste is formed by the use of a method of an intaglio printing or a mimeograph printing, or a thin line pattern of electroless-plating catalytic ink is formed by the use of a method of the intaglio printing or the mimeograph printing on the resin substrate film. After that, the thin line pattern for forming a metal film on the thin line pattern by the plating process is formed to form the electroconductive thin line. COPYRIGHT: (C)2009,JPO&amp;INPIT</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20090604&amp;DB=EPODOC&amp;CC=JP&amp;NR=2009123791A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20090604&amp;DB=EPODOC&amp;CC=JP&amp;NR=2009123791A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OGATA HIROSHI</creatorcontrib><creatorcontrib>TSUBOTA MASANORI</creatorcontrib><creatorcontrib>SHIOMI HIDEKAZU</creatorcontrib><title>METHOD OF FORMING ELECTROCONDUCTIVE THIN LINE</title><description>PROBLEM TO BE SOLVED: To provide a method for forming a high-definition conductive thin line without blurring at low cost. SOLUTION: After a resin film having a hardness of 20 to 70 by the JIS-K-6253 type A measuring method is formed on the surface of a resin substrate, the thin line of a conductive paste is formed by the use of a method of an intaglio printing or a mimeograph printing, or a thin line pattern of electroless-plating catalytic ink is formed by the use of a method of the intaglio printing or the mimeograph printing on the resin substrate film. After that, the thin line pattern for forming a metal film on the thin line pattern by the plating process is formed to form the electroconductive thin line. COPYRIGHT: (C)2009,JPO&amp;INPIT</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND1dQ3x8HdR8HdTcPMP8vX0c1dw9XF1Dgnyd_b3cwl1DvEMc1UI8fD0U_Dx9HPlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgaWhkbG5paGjsZEKQIACb4l8Q</recordid><startdate>20090604</startdate><enddate>20090604</enddate><creator>OGATA HIROSHI</creator><creator>TSUBOTA MASANORI</creator><creator>SHIOMI HIDEKAZU</creator><scope>EVB</scope></search><sort><creationdate>20090604</creationdate><title>METHOD OF FORMING ELECTROCONDUCTIVE THIN LINE</title><author>OGATA HIROSHI ; TSUBOTA MASANORI ; SHIOMI HIDEKAZU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2009123791A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>OGATA HIROSHI</creatorcontrib><creatorcontrib>TSUBOTA MASANORI</creatorcontrib><creatorcontrib>SHIOMI HIDEKAZU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OGATA HIROSHI</au><au>TSUBOTA MASANORI</au><au>SHIOMI HIDEKAZU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF FORMING ELECTROCONDUCTIVE THIN LINE</title><date>2009-06-04</date><risdate>2009</risdate><abstract>PROBLEM TO BE SOLVED: To provide a method for forming a high-definition conductive thin line without blurring at low cost. SOLUTION: After a resin film having a hardness of 20 to 70 by the JIS-K-6253 type A measuring method is formed on the surface of a resin substrate, the thin line of a conductive paste is formed by the use of a method of an intaglio printing or a mimeograph printing, or a thin line pattern of electroless-plating catalytic ink is formed by the use of a method of the intaglio printing or the mimeograph printing on the resin substrate film. After that, the thin line pattern for forming a metal film on the thin line pattern by the plating process is formed to form the electroconductive thin line. COPYRIGHT: (C)2009,JPO&amp;INPIT</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title METHOD OF FORMING ELECTROCONDUCTIVE THIN LINE
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