METHOD OF FORMING ELECTROCONDUCTIVE THIN LINE

PROBLEM TO BE SOLVED: To provide a method for forming a high-definition conductive thin line without blurring at low cost. SOLUTION: After a resin film having a hardness of 20 to 70 by the JIS-K-6253 type A measuring method is formed on the surface of a resin substrate, the thin line of a conductive...

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Bibliographische Detailangaben
Hauptverfasser: OGATA HIROSHI, TSUBOTA MASANORI, SHIOMI HIDEKAZU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for forming a high-definition conductive thin line without blurring at low cost. SOLUTION: After a resin film having a hardness of 20 to 70 by the JIS-K-6253 type A measuring method is formed on the surface of a resin substrate, the thin line of a conductive paste is formed by the use of a method of an intaglio printing or a mimeograph printing, or a thin line pattern of electroless-plating catalytic ink is formed by the use of a method of the intaglio printing or the mimeograph printing on the resin substrate film. After that, the thin line pattern for forming a metal film on the thin line pattern by the plating process is formed to form the electroconductive thin line. COPYRIGHT: (C)2009,JPO&INPIT