CLUSTER TYPE SEMICONDUCTOR PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a cluster semiconductor processing apparatus of which throughput is increased, footprint is reduced and maintenance performance is improved. SOLUTION: A cluster semiconductor processing apparatus includes wafer handling chambers 5 and 6 having a polygonal base includ...

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Bibliographische Detailangaben
Hauptverfasser:	SUWADA MASAE, TAKIZAWA MASAHIRO, HAGINO TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a cluster semiconductor processing apparatus of which throughput is increased, footprint is reduced and maintenance performance is improved. SOLUTION: A cluster semiconductor processing apparatus includes wafer handling chambers 5 and 6 having a polygonal base including multiple sides for wafer processing chambers and two adjacent sides for wafer loading/unloading chambers as viewed in a direction of an axis of the wafer handling chambers 5 and 6. An angle A between two adjacent sides of the multiple sides for wafer processing chambers is greater than an angle B which is calculated by dividing 360° by the number of the total sides consisting of the multiple sides for wafer processing chambers and the two adjacent sides for wafer loading/unloading chambers. COPYRIGHT: (C)2009,JPO&INPIT