METHOD OF MANUFACTURING WIRING CIRCUIT BOARD WITH BUMPS

PROBLEM TO BE SOLVED: To achieve the high density of a wiring circuit board through formation of microscopic patterns by preventing the width of circuit patterns from getting thin due to etching during formation of the wiring circuit board with bumps. SOLUTION: One surface laminate sheet 10 having a seed layer 12 is prepared on one surface of an insulating base material 11. A plated resist layer 14 is arranged on the portion of the surface of the seed layer 12 excluding a circuit forming portion 13. A wiring circuit pattern 15 is formed on the surface of the exposed seed layer 12 by plating. An etch resist layer 17 is formed in the planned bump forming portion 16a on this wiring circuit pattern 15. The exposed portion of the wiring circuit pattern is made thinner by etching so that the height of the planned bump forming portion 16a may be a predetermined height. After removing the plated resist layer 14 and etch resist layer 17, the exposed seed layer 12 is removed by etching. COPYRIGHT: (C)2009,JPO&INPIT