PACKAGE

PROBLEM TO BE SOLVED: To provide a package on which a different package is to be loaded, capable of surely withstanding impacts or loads that the package itself receives from the outside (including the other packages), when it drops off, or the like, in a state where a plurality of packages are stac...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: MAEHARA SHINJI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a package on which a different package is to be loaded, capable of surely withstanding impacts or loads that the package itself receives from the outside (including the other packages), when it drops off, or the like, in a state where a plurality of packages are stacked and mounted on a printed board, or the like. SOLUTION: The package P1, on which a different package P2 is loaded includes, the package body 2 provided with a front surface 3 and a back surface 4 and constituted of ceramic (insulator); a cavity 5 opened to the front surface 3 of the package body 2; a plurality of metal layers 10 formed in the vicinity of every corner on the front surface 3 of the package body 2; and projection parts 12 and 14, provided between the mutually adjacent metal layers 10 among the plurality of metal layers 10. COPYRIGHT: (C)2009,JPO&INPIT