NON-RECIPROCAL CIRCUIT ELEMENT AND COMMUNICATION DEVICE

PROBLEM TO BE SOLVED: To provide a non-reciprocal circuit element which is compact and thin, has a simple bonding structure for respective functional components, hardly causes an open-circuit defect due to a bonding defect of a bonding place and a short-circuit defect due to a short circuit between...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OHATA SHUSUKE, KASAHARA RYUICHI, MATSUMARU YOSHINORI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a non-reciprocal circuit element which is compact and thin, has a simple bonding structure for respective functional components, hardly causes an open-circuit defect due to a bonding defect of a bonding place and a short-circuit defect due to a short circuit between functional components, and neither cracks nor breaks at functional component low in mechanical strength or an attached portion thereof due to loads in an assembly process or after the assembly, and to provide a communication device. SOLUTION: A wiring board 5 has first to sixth top conductor patterns 51 to 56 and first to fourth reverse conductor patterns 512, 542, 553, and 562 formed on the top and reverse surfaces of a dielectric film 50, and the reverse surface is put over the top surface of a first yoke member 4. A magnetic rotor 1 and circuit components (C1, C2, C3, R1, and R2) are disposed on the same top surface of the wiring board 5, and connected to the first to the fourth top conductor patterns 51 to 55. COPYRIGHT: (C)2009,JPO&INPIT