WIRING BOARD

PROBLEM TO BE SOLVED: To provide a wiring board whose size in the thickness direction of the wiring board can be made small, and whose cost can be reduced, in the wiring board. SOLUTION: The thickness T1of the portion, which is placed between an electronic component mounting pad 18 and wiring 22, of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KOBAYASHI KAZUHIRO, MIYAMOTO TAKAHARU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!