WIRING BOARD

WIRING BOARD

PROBLEM TO BE SOLVED: To provide a wiring board whose size in the thickness direction of the wiring board can be made small, and whose cost can be reduced, in the wiring board. SOLUTION: The thickness T1of the portion, which is placed between an electronic component mounting pad 18 and wiring 22, of...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KOBAYASHI KAZUHIRO, MIYAMOTO TAKAHARU
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a wiring board whose size in the thickness direction of the wiring board can be made small, and whose cost can be reduced, in the wiring board. SOLUTION: The thickness T1of the portion, which is placed between an electronic component mounting pad 18 and wiring 22, of an insulating layer 17 (insulating layer in which the electronic component mounting pads 18 are placed) is set to be smaller than the thickness T2of the portion, which is placed between the wiring 22 and wiring 25, of an insulating layer 23. COPYRIGHT: (C)2009,JPO&INPIT