THERMALLY CONDUCTIVE FILLER AND MOLDED PRODUCT USING THE SAME

PROBLEM TO BE SOLVED: To provide a highly thermally conductive pitch-based carbon short fiber filler having high moldability, and to provide a composite molding material. SOLUTION: The pitch-based carbon short fiber filler has >10 to ≤40 μm average fiber diameter (L1) observed under an optical mi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ONOE SHUHEI, TAKAGI SHOICHI, HARA HIROSHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a highly thermally conductive pitch-based carbon short fiber filler having high moldability, and to provide a composite molding material. SOLUTION: The pitch-based carbon short fiber filler has >10 to ≤40 μm average fiber diameter (L1) observed under an optical microscope, a closed graphene sheet in observation of a filler end face under a transmission type electron microscope, and a substantially flat surface observed under a scanning electron microscope. COPYRIGHT: (C)2009,JPO&INPIT