METHOD OF MANUFACTURING ALUMINUM BASE HEAT DISSIPATION BOARD FOR ELECTRICAL CIRCUIT

PROBLEM TO BE SOLVED: To provide a method of manufacturing a heat dissipation board for an electrical circuit having excellent heat dissipation property by reliably carrying out sealing treatment on an aluminum board having an insulating layer formed by anodizing for a short time. SOLUTION: In the m...

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Bibliographische Detailangaben
1. Verfasser:	SUGAMOTO NORIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a heat dissipation board for an electrical circuit having excellent heat dissipation property by reliably carrying out sealing treatment on an aluminum board having an insulating layer formed by anodizing for a short time. SOLUTION: In the method of manufacturing the heat dissipation board for the electrical circuit by which a metallic coating film is formed by electroplating after forming a metal seed layer by a vapor phase growth method on the surface of the aluminum board having the insulating film formed by anodizing, the aluminum board after anodized is sealing-treated with a weak alkaline aqueous solution having pH buffering action and showing pH 7.0-9.0. COPYRIGHT: (C)2009,JPO&INPIT