PICKUP APPARATUS AND PICKUP METHOD

PROBLEM TO BE SOLVED: To provide a pickup apparatus and pickup method capable of reliably peeling adhered materials from an adhesive sheet when the adhered materials stuck on the adhesive sheet are knocked up by jetting a high-pressure fluid from the back side of the adhered materials without causin...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KAWASHIMA ISAMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!