PICKUP APPARATUS AND PICKUP METHOD
PROBLEM TO BE SOLVED: To provide a pickup apparatus and pickup method capable of reliably peeling adhered materials from an adhesive sheet when the adhered materials stuck on the adhesive sheet are knocked up by jetting a high-pressure fluid from the back side of the adhered materials without causin...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a pickup apparatus and pickup method capable of reliably peeling adhered materials from an adhesive sheet when the adhered materials stuck on the adhesive sheet are knocked up by jetting a high-pressure fluid from the back side of the adhered materials without causing the failure of adhesion. SOLUTION: This pickup apparatus 1 includes a nozzle oscillating mechanism part 2 for rotatably varying the tip direction of a jet nozzle 24 jetting a high-pressure air 22 from the back side of a semiconductor chip 14 stuck on an adhesive sheet 13 to knock up the semiconductor chip 14. COPYRIGHT: (C)2009,JPO&INPIT |
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