INORGANIC FILLER AND ORGANIC FILLER-CONTAINING CURABLE RESIN COMPOSITION, RESIST FILM COATED PRINTED WIRING BOARD, AND METHOD FOR PRODUCING THE SAME

PROBLEM TO BE SOLVED: To provide a curable resin composition capable of imparting a higher functional property to a cured film because even when an inorganic filler is highly blended with a curable resin composition, a cured film is excellent in cracking resistance, therefore a larger amount of a fu...

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Bibliographische Detailangaben
Hauptverfasser:	USUI YUKIHIRO, KUNO TOSHIMITSU, AZEYANAGI YASUHIRO, KOFUNEI MAKOTO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a curable resin composition capable of imparting a higher functional property to a cured film because even when an inorganic filler is highly blended with a curable resin composition, a cured film is excellent in cracking resistance, therefore a larger amount of a functional inorganic filler can be blended. SOLUTION: The curable resin composition comprises: (I) 100 pts.wt. of a curable resin; (II) 10-1,200 pts.wt. of an inorganic filler; and (III) 1-100 pts.wt. of an organic filler having an elastic modulus of 1-2,000 (MPa) and an average particle diameter of 0.01-10 μm, wherein a content weight ratio of the components (II) and (III) is 1-40. COPYRIGHT: (C)2009,JPO&INPIT